? semiconductor components industries, llc, 2014 february, 2014 ? rev. 6 1 publication order number: murf1660ct/d MURF1660CTG switch-mode power rectifier these state ? of ? the ? art devices are designed for use in switching power supplies, inverters and as free wheeling diodes. features ? ultrafast 60 nanosecond recovery times ? 150 c operating junction temperature ? epoxy meets ul 94 v ? 0 @ 0.125 in ? high temperature glass passivated junction ? low leakage specified @ 150 c case temperature ? current derating @ both case and ambient temperatures ? electrically isolated. no isolation hardware required. ? this is a pb ? free package* mechanical characteristics: ? case: epoxy, molded ? weight: 1.9 grams (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead temperature for soldering purposes: 260 c max. for 10 seconds maximum ratings (per leg) rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 600 v average rectified forward current total device, (rated v r ), t c = 150 c per diode per device i f(av) 8 16 a peak repetitive forward current (rated v r , square wave, 20 khz), t c = 150 c i fm 16 a non ? repetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 100 a operating junction and storage temperature t j , t stg ? 65 to +150 c rms isolation voltage (t = 0.3 second, r.h. 30%, t a = 25 c) (note 1) per figure 3 v iso1 4500 v stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. proper strike and creepage distance must be provided. *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. device package shipping ordering information ultrafast rectifier 16 amperes, 600 volts 2 1 3 MURF1660CTG to ? 220 (pb ? free) 50 units / rail http://onsemi.com isolated to ? 220 case 221ah 3 1 2 marking diagram a = assembly location y = year ww = work week u1660 = device code g = pb ? free package aka = diode polarity ayww u1660g a k a
MURF1660CTG http://onsemi.com 2 thermal characteristics (per leg) characteristic symbol value unit maximum thermal resistance, junction ? to ? case r jc 3.0 c/w lead temperature for soldering purposes: 1/8 from case for 5 seconds t l 260 c electrical characteristics (per leg) characteristic symbol value unit maximum instantaneous forward voltage (note 2) (i f = 8.0 a, t c = 150 c) (i f = 8.0 a, t c = 25 c) v f 1.20 1.50 v maximum instantaneous reverse current (note 2) (rated dc voltage, t c = 150 c) (rated dc voltage, t c = 25 c) i r 500 10 a maximum reverse recovery time (i f = 1.0 a, di/dt = 50 a/ s) (i f = 0.5 a, i r = 1.0 a, i rec = 0.25 a) t rr 60 50 ns product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 2. pulse test: pulse width = 300 s, duty cycle 2.0%. v r , reverse voltage (v) i r , reverse current (a) 0.01 0.1 1.0 10 100 10 k 600 500 400 300 200 100 100 50 20 , instantaneous forward current (amps) i f 10 5 2 1 0.5 0.2 0.1 0.4 0.6 1.0 1.2 1.6 1.8 v f , instantaneous voltage (v) figure 1. typical forward voltage, per leg 100 c 25 c t j = 150 c 0.8 1.4 100 c 25 c 1.0 k t j = 150 c figure 2. typical reverse current, per leg*
MURF1660CTG http://onsemi.com 3 test condition for isolation test* fully isolated package leads heatsink 0.110 min figure 3. mounting position * measurement made between leads and heatsink with all leads shorted together. mounting information clip heatsink figure 4. typical mounting technique clip ? mounted
MURF1660CTG http://onsemi.com 4 package dimensions to ? 220 fullpack, 3 ? lead case 221ah issue e dim min max millimeters d 14.70 15.30 e 9.70 10.30 a 4.30 4.70 b 0.54 0.84 p 3.00 3.40 e l1 --- 2.10 c 0.49 0.79 l 12.70 14.73 b2 1.10 1.40 q 2.80 3.20 a2 2.50 2.90 a1 2.50 2.90 h1 6.70 7.10 e q l1 b2 e d l p 123 b seating plane a a1 h1 a2 c notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. contour uncontrolled in this area. 4. dimensions d and e do not include mold flash and gate protrusions. mold flash and gate protrusions not to exceed 0.13 per side. these dimensions are to be measured at outermost extreme of the plastic body. 5. dimension b2 does not include dambar protrusion. lead width including protrusion shall not exceed 2.00. 2.54 bsc m 0.14 m a a b c e/2 m 0.25 m a b 3x c 3x b note 3 on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other inte llectual property. a listing of scillc?s product/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent ? marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typical s? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 murf1660ct/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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